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TVS Diode Arrays (SPA ? Diodes)
General Purpose ESD Protection - SP1001 Series
Soldering Parameters
Reflow Condition
- Temperature Min (T s(min) )
Pre Heat - Temperature Max (T s(max) )
- Time (min to max) (t s )
Average ramp up rate (Liquidus) Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
T P
T L
T S(max)
T S(min)
t S
Ramp-up
Preheat
t P
t L
Critical Zone
T L to T P
Ramp-down
Reflow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
Time
Peak Temperature (T P )
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
Do not exceed
Part Numbering System
260 +0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes max.
260°C
Product Characteristics
SP1001-0 * * T G
TVS Diode Arrays
(SPA ? Diodes)
Series
Number of Channels
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Part Marking System
G= Green
T= Tape & Reel
Package
J = SC70-3, SC70-5 or SC70-6
X = SOT553 or SOT563
V = SOT963
Lead Plating
Lead Material
Lead Coplanarity
Substitute
Material
Body Material
Flammability
Notes :
Matte Tin (SC70-x) Pre-Plated Frame
(SOT5x3, SOT963)
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
A * *
1. All dimensions are in millimeters
2. Dimensions include solder plating.
A **
Product Series Number of Channels
A = SP1001 series (varies)
Assembly Site
(varies)
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
SP1001-02JTG
SP1001-02XTG
SP1001-04JTG
SP1001-04XTG
SP1001-05JTG
SP1001-05VTG
SP1001-05XTG
Package
SC70-3
SOT553
SC70-5
SOT553
SC70-6
SOT963
SOT563
Marking
A * 2
A * 2
A * 4
A * 4
A * 5
A * 5
A * 5
Min. Order Qty.
3000
3000
3000
3000
3000
8000
3000
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
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